IEEE - Institute of Electrical and Electronics Engineers, Inc. - Mobility and Kinematics Analysis of a Novel 5-DOF Hybrid Manipulator for Reconditioning of Mould and Die Tools: Part 1

2008 15th International Conference on Mechatronics and Machine Vision in Practice

Author(s): D. Modungwa ; K. Bolele ; N.S. Tlale ; C.M. Kumile ; A. Shaik
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 December 2008
Conference Location: Auckland, New Zealand
Conference Date: 2 December 2008
Page(s): 418 - 422
ISBN (CD): 978-0-473-13532-4
ISBN (Paper): 978-1-4244-3779-5
DOI: 10.1109/MMVIP.2008.4749570
Regular:

In this paper, the requirements for a mechanical manipulator for achieving reconditioning of mould and die tools are determined. Reconditioning of mould and die tools involves the following... View More

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