IEEE - Institute of Electrical and Electronics Engineers, Inc. - Neural Network Controlled Gripper for Wire Bonding Machines in Semiconductor Fabrication

2008 15th International Conference on Mechatronics and Machine Vision in Practice

Author(s): K. Baskaran ; R. Savitha
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 December 2008
Conference Location: Auckland, New Zealand
Conference Date: 2 December 2008
Page(s): 323 - 326
ISBN (CD): 978-0-473-13532-4
ISBN (Paper): 978-1-4244-3779-5
DOI: 10.1109/MMVIP.2008.4749554
Regular:

Extensive research focus is on the appropriate usage of neural networks in automation industry. This paper presents a neural network based approach for the wire-bonding machine in the... View More

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