IEEE - Institute of Electrical and Electronics Engineers, Inc. - Mobility and Kinematics Analysis of a Novel 5-DOF Hybrid Manipulator for Reconditioning of Mold and Die Tools: Part 2

2008 15th International Conference on Mechatronics and Machine Vision in Practice

Author(s): K. Bolele ; D. Modungwa ; N.S. Tlale ; C.M. Kumile
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 December 2008
Conference Location: Auckland, New Zealand
Conference Date: 2 December 2008
Page(s): 183 - 188
ISBN (CD): 978-0-473-13532-4
ISBN (Paper): 978-1-4244-3779-5
DOI: 10.1109/MMVIP.2008.4749530
Regular:

Two novel hybrid manipulators that can be used for reconditioning of mould and die tools are presented in this paper. These designs have been developed using the knowledge of the different... View More

Advertisement