IEEE - Institute of Electrical and Electronics Engineers, Inc. - A Precise Inspection Technique for Wafer Pre-sawing Lines using Affine Transformation

2008 15th International Conference on Mechatronics and Machine Vision in Practice

Author(s): H.T. Kim ; K.W. Lee ; S.C. Kim ; H.J. Yang
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 December 2008
Conference Location: Auckland, New Zealand
Conference Date: 2 December 2008
Page(s): 68 - 74
ISBN (CD): 978-0-473-13532-4
ISBN (Paper): 978-1-4244-3779-5
DOI: 10.1109/MMVIP.2008.4749509
Regular:

This study proposes a simple and fast technique for detecting wafer cutting lines using the Affine transformation before sawing. This technique was developed for the purpose of wafer alignment... View More

Advertisement