IEEE - Institute of Electrical and Electronics Engineers, Inc. - Enabling high-performance RF designs using Z-interconnect: Materials, manufacturing and electrical performance

MILCOM 2008 - 2008 IEEE Military Communications Conference

Author(s): M.J. Rowlands ; R.N. Das ; J. Lauffer
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 November 2008
Conference Location: San Diego, CA, USA
Conference Date: 16 November 2008
Page(s): 1 - 7
ISBN (CD): 978-1-4244-2677-5
ISBN (Paper): 978-1-4244-2676-8
DOI: 10.1109/MILCOM.2008.4753042
Regular:

More and more board and chip package RF designs require high-signal density while delivering frequencies in the tens of gigahertz. The challenges for organic substrate in meeting these electrical... View More

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