IEEE - Institute of Electrical and Electronics Engineers, Inc. - Competency-Related Pay on a Banding Platform: Creating a High-Performance

2008 4th International Conference on Wireless Communications, Networking and Mobile Computing (WiCOM)

Author(s): Chen Weijing ; Yang Qing
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 October 2008
Conference Location: Dalian, China
Conference Date: 12 October 2008
Page(s): 1 - 3
ISBN (CD): 978-1-4244-2108-4
ISBN (Paper): 978-1-4244-2107-7
DOI: 10.1109/WiCom.2008.1726
Regular:

In increasingly global and hyper competitive markets, to relate competencies and pay is a growing trend. This paper analyzes the key elements to link competence to pay. Establishes a model of an... View More

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