IEEE - Institute of Electrical and Electronics Engineers, Inc. - Thermal aware FPGA architectures and CAD

2008 International Conference on Field Programmable Logic and Applications (FPL)

Author(s): S. Bhoj
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 September 2008
Conference Location: Heidelberg, Germany
Conference Date: 8 September 2008
Page(s): 701 - 702
ISBN (CD): 978-1-4244-1961-6
ISBN (Paper): 978-1-4244-1960-9
DOI: 10.1109/FPL.2008.4630045
Regular:

As a result of our research so far, our placement tool achieved temperature reductions of over 10degC while the adaptive FPGA architectures generate timely responses to bring down temperature by... View More

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