IEEE - Institute of Electrical and Electronics Engineers, Inc. - Temperature Aware Floorplanning via Geometry Programming

2008 11th IEEE International Conference on Computational Science and Engineering Workshops (CSEWORKSHOPS)

Author(s): Yiming Li ; Ying-Chieh Chen ; Hui-Wen Cheng
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 July 2008
Conference Location: San Paulo, Brazil
Conference Date: 16 July 2008
Page(s): 295 - 298
ISBN (Paper): 978-0-7695-3257-8
DOI: 10.1109/CSEW.2008.40
Regular:

Power density of microprocessors is increasing with every new process generation resulting in increasingly higher chip temperatures. The high temperature of the chip greatly affects its... View More

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