IEEE - Institute of Electrical and Electronics Engineers, Inc. - Single-Pass Grinding -- An Effective Manufacturing Method for Finishing

2008 19th International Conference on Systems Engineering (ICSENG)

Author(s): K. Nadolny ; J. Plichta ; D. Herman ; B. Slowinski
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 August 2008
Conference Location: Las Vegas, NV, USA
Conference Date: 19 August 2008
Page(s): 236 - 241
ISBN (Paper): 978-0-7695-3331-5
DOI: 10.1109/ICSEng.2008.94
Regular:

The paper presents the essence of the single-pass internal cylindrical grinding process. There is a descriptive presentation of the grinding wheels of zonally diversified structure and the... View More

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