IEEE - Institute of Electrical and Electronics Engineers, Inc. - The Mechanism Design of Third Party Assure-Payment Platform

2008 International Symposium on Electronic Commerce and Security

Author(s): Yong Xu
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 August 2008
Conference Location: Guangzhou City, China
Conference Date: 3 August 2008
Page(s): 780 - 784
ISBN (Paper): 978-0-7695-3258-5
DOI: 10.1109/ISECS.2008.18
Regular:

This paper puts forward a new thought of application about the third party assure-payment platform in BtoB mode. The third payment platform has often been applied to BtoC and CtoC, as the... View More

Advertisement