IEEE - Institute of Electrical and Electronics Engineers, Inc. - The Credit Risk Analysis and Prevention of Third Party Payment Platform

2008 International Symposium on Electronic Commerce and Security

Author(s): Liu Jindi ; Xu Yong
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 August 2008
Conference Location: Guangzhou City, China
Conference Date: 3 August 2008
Page(s): 573 - 576
ISBN (Paper): 978-0-7695-3258-5
DOI: 10.1109/ISECS.2008.76
Regular:

According to the application of third party payment platform in B2C and C2C, this paper puts forward a precaution scheme against the credit risk. As a product of lack of credit, the third party... View More

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