IEEE - Institute of Electrical and Electronics Engineers, Inc. - Experiment study on bonding tool of thermosonic transducer for flip-chip bonding

IEEE/ASME International Conference on Advanced Intelligent Mechatronics. AIM 2008

Author(s): Yi-Cheng Huang ; Kun-Yang Li ; Chi-Hui Chen
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 July 2008
Conference Location: Xian, China
Conference Date: 2 July 2008
Page(s): 1,002 - 1,007
ISBN (CD): 978-1-4244-2495-5
ISBN (Paper): 978-1-4244-2494-8
DOI: 10.1109/AIM.2008.4601798
Regular:

The thermosonic bonding parameters on LEDs involve different bonding temperatures, different bonding force, different bonding time and different ultrasonic power. Improving the efficiency of... View More

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