IEEE - Institute of Electrical and Electronics Engineers, Inc. - DMA properties of semiconductive composites in power cables by dual filler system

2008 International Conference on Condition Monitoring and Diagnosis, CMD 2008

Author(s): Hoon Yang ; Hyun-Hoo Kim ; Dae-Hee Park
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 April 2008
Conference Location: Beijing, China
Conference Date: 21 April 2008
Page(s): 299 - 302
ISBN (CD): 978-1-4244-1622-6
ISBN (Paper): 978-1-4244-1621-9
DOI: 10.1109/CMD.2008.4580286
Regular:

This paper applied DMA to investigate the storage modulus, loss modulus, and Tandelta of nano-composite materials using a dual filler system that is fabricated by using different contents of CNT... View More

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