IEEE - Institute of Electrical and Electronics Engineers, Inc. - Ultra-high bandwidth memory with 3D-stacked emerging memory cells

2008 IEEE International Conference on IC Design and Technology & Tutorial (ICICDT)

Author(s): K. Abe ; M.P. Tendulkar ; J.R. Jameson ; P.B. Griffin ; K. Nomura ; S. Fujita ; Y. Nishi
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 June 2008
Conference Location: Austin, TX, USA
Conference Date: 2 June 2008
Page(s): 203 - 206
ISBN (CD): 978-1-4244-1811-4
ISBN (Paper): 978-1-4244-1810-7
DOI: 10.1109/ICICDT.2008.4567279
Regular:

To increase memory bandwidth with minimum area overhead, the new concept of 3D-stacked memory structure consisting of a small sense amplifier shared with a few 3D memory cells has been presented.... View More

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