IEEE - Institute of Electrical and Electronics Engineers, Inc. - 3D-structured on-chip buck converter for distributed power supply system in SiPs

2008 IEEE International Conference on IC Design and Technology & Tutorial (ICICDT)

Author(s): M. Takamiya ; K. Onizuka ; T. Sakurai
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 June 2008
Conference Location: Austin, TX, USA
Conference Date: 2 June 2008
Page(s): 33 - 36
ISBN (CD): 978-1-4244-1811-4
ISBN (Paper): 978-1-4244-1810-7
DOI: 10.1109/ICICDT.2008.4567240
Regular:

An on-chip buck converter with 3D chip stacking is proposed and the operation is experimentally verified. The manufactured converter achieves a maximum power efficiency of 62% for an output... View More

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