IEEE - Institute of Electrical and Electronics Engineers, Inc. - Modeling multilayer power distribution network by systematically incorporating via and cavity models

2008 1st Asia-Pacific Symposium on Electromagnetic Compatibility (APEMC) & 19th International Zurich Symposium on Electromagnetic Compatibility

Author(s): Yaojiang Zhang ; F. De Paulis ; J. Fan
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 May 2008
Conference Location: Singapore, Singapore
Conference Date: 19 May 2008
Page(s): 335 - 338
ISBN (CD): 978-981-08-0629-3
DOI: 10.1109/APEMC.2008.4559880
Regular:

A closed-form expression for via barrel-plate capacitances is derived. This results in a more accurate equivalent circuit model for decoupling capacitors including both parasitic inductances and... View More

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