IEEE - Institute of Electrical and Electronics Engineers, Inc. - Line-spike induced failure mechanism in integrated circuit bond-wires

2008 IEEE International Reliability Physics Symposium (IRPS)

Author(s): Seokjin Kim ; Kwangsik Choi ; M. Peckerar ; A. Christou
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 April 2008
Conference Location: Phoenix, AZ, USA
Conference Date: 27 April 2008
Page(s): 647 - 648
ISBN (CD): 978-1-4244-2050-6
ISBN (Paper): 978-1-4244-2049-0
DOI: 10.1109/RELPHY.2008.4558969
Regular:

A novel type of bond wire failure is described. In the present mechanism, the voltage line spikes are of such a short duration that they cannot propagate into the chip core circuits and cause... View More

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