IEEE - Institute of Electrical and Electronics Engineers, Inc. - Reliability assessment of high temperature electronics and packaging technologies for Venus mission

2008 IEEE International Reliability Physics Symposium (IRPS)

Author(s): Yuan Chen ; L. Del Castillo ; N. Aranki ; C. Assad ; M. Mazzola ; M. Mojarradi ; E. Kolawa
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 April 2008
Conference Location: Phoenix, AZ, USA
Conference Date: 27 April 2008
Page(s): 641 - 642
ISBN (CD): 978-1-4244-2050-6
ISBN (Paper): 978-1-4244-2049-0
DOI: 10.1109/RELPHY.2008.4558966
Regular:

In this paper, the potentials of the current state-of-the-art electronics and packaging technologies for Venus missions is evaluated and intend to address the survivability and reliability of the... View More

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