IEEE - Institute of Electrical and Electronics Engineers, Inc. - Emerging reliability challenges in electronic packaging

2008 IEEE International Reliability Physics Symposium (IRPS)

Author(s): D.R. Frear ; L.N. Ramanathan ; J.-W. Jang ; N.L. Owens
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 April 2008
Conference Location: Phoenix, AZ, USA
Conference Date: 27 April 2008
Page(s): 450 - 454
ISBN (CD): 978-1-4244-2050-6
ISBN (Paper): 978-1-4244-2049-0
DOI: 10.1109/RELPHY.2008.4558927
Regular:

The trend for microelectronic devices has historically been, and will continue to be, towards smaller feature size, faster speeds, more complexity, higher power and lower cost. The motivating... View More

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