IEEE - Institute of Electrical and Electronics Engineers, Inc. - Impact of via interactions and metal slotting on stress induced voiding

2008 IEEE International Reliability Physics Symposium (IRPS)

Author(s): G.D.R. Hall ; D.D.J. Allman ; H.D. Bhatt
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 April 2008
Conference Location: Phoenix, AZ, USA
Conference Date: 27 April 2008
Page(s): 392 - 398
ISBN (CD): 978-1-4244-2050-6
ISBN (Paper): 978-1-4244-2049-0
DOI: 10.1109/RELPHY.2008.4558918
Regular:

Stress induced voiding was investigated for a 0.13 mum Cu/low-k interconnect process. The focus of our study was on the ldquohumprdquo failure mode using a statistical approach to both the design... View More

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