IEEE - Institute of Electrical and Electronics Engineers, Inc. - Analysis of Horizontal and Vertical Couplings in Bonding Wire Interconnections Using EFIE with Cylindrical Conduction Mode Basis Functions

IEEE Workshop on Signal Propagation on Interconnects (SPI 2008)

Author(s): Ki Jin Han ; M. Swaminathan ; E. Engin
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 May 2008
Conference Location: Avignon, France
Conference Date: 12 May 2008
Page(s): 1 - 4
ISBN (CD): 978-1-4244-2318-7
ISBN (Paper): 978-1-4244-2317-0
DOI: 10.1109/SPI.2008.4558394
Regular:

To clarify the initial step of 3-D interconnection design, this paper shows electrical characteristics of vertically and horizontally coupled bonding wire interconnections. For efficient analysis,... View More

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