IEEE - Institute of Electrical and Electronics Engineers, Inc. - Hierarchical modeling of heat transfer in silicon-based electronic devices

2008 11th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITHERM '08)

Author(s): J.V. Goicochea ; M. Madrid ; C. Amon
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 May 2008
Conference Location: Orlando, FL, USA
Conference Date: 28 May 2008
Page(s): 1,006 - 1,017
ISBN (CD): 978-1-4244-1701-8
ISBN (Paper): 978-1-4244-1700-1
ISSN (Paper): 1087-9870
DOI: 10.1109/ITHERM.2008.4544376
Regular:

Heat transfer modeling in electronic devices has gained importance over the last decade in the design of better performing devices. The trend towards miniaturization of these devices has led to... View More

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