IEEE - Institute of Electrical and Electronics Engineers, Inc. - Study of thermal fatigue life caused by dispersion of solder joint

2008 11th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITHERM '08)

Author(s): K. Takagi ; Qiang Yu ; T. Shibutani ; H. Miyauch ; M. Shirator ; Y. Noro
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 May 2008
Conference Location: Orlando, FL, USA
Conference Date: 28 May 2008
Page(s): 883 - 888
ISBN (CD): 978-1-4244-1701-8
ISBN (Paper): 978-1-4244-1700-1
ISSN (Paper): 1087-9870
DOI: 10.1109/ITHERM.2008.4544359
Regular:

The fatigue life considering dispersion of solder joints on chip resistor was investigated by experimental approach and analytical approach. The significant difference of crack propagation ratio... View More

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