IEEE - Institute of Electrical and Electronics Engineers, Inc. - Aging-informed behavior of Sn3.8Ag0.7Cu solder alloys

2008 11th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITHERM '08)

Author(s): K. Mysore ; D. Chan ; D. Bhate ; G. Subbarayan ; I. Dutta ; V. Gupta ; J. Zhao ; D. Edwards
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 May 2008
Conference Location: Orlando, FL, USA
Conference Date: 28 May 2008
Page(s): 870 - 875
ISBN (CD): 978-1-4244-1701-8
ISBN (Paper): 978-1-4244-1700-1
ISSN (Paper): 1087-9870
DOI: 10.1109/ITHERM.2008.4544357
Regular:

Predicting reliability of solder joints requires a thorough understanding of solder constitutive behavior. Recent studies on SnAgCu solder alloys have reported that pre-test conditions of... View More

Advertisement