IEEE - Institute of Electrical and Electronics Engineers, Inc. - Trace line failure analysis and characterization of the panel base package (PBP™) technology with fan-out capability

2008 11th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITHERM '08)

Author(s): Ming-Chih Yew ; Chung-Jung Wu ; Ching-Shun Huang ; Mars Tsai ; Dyi-Chung Hu ; Wen-Kung Yang ; Kuo-Ning Chiang
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 May 2008
Conference Location: Orlando, FL, USA
Conference Date: 28 May 2008
Page(s): 862 - 869
ISBN (CD): 978-1-4244-1701-8
ISBN (Paper): 978-1-4244-1700-1
ISSN (Paper): 1087-9870
DOI: 10.1109/ITHERM.2008.4544356
Regular:

The wafer level package (WLP) is a cost-effective solution for the electronic package, and has been increasingly applied during recent years. In this study, a new packaging technology developed... View More

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