IEEE - Institute of Electrical and Electronics Engineers, Inc. - Fracture, delamination, and buckling of elastic thin films on compliant substrates

2008 11th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITHERM '08)

Author(s): Haixia Mei ; Yaoyu Pang ; Se Hyuk Im ; Rui Huang
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 May 2008
Conference Location: Orlando, FL, USA
Conference Date: 28 May 2008
Page(s): 762 - 769
ISBN (CD): 978-1-4244-1701-8
ISBN (Paper): 978-1-4244-1700-1
ISSN (Paper): 1087-9870
DOI: 10.1109/ITHERM.2008.4544345
Regular:

A series of studies have been conducted for mechanical behavior of elastic thin films on compliant substrates. Under tension, the film may fracture by growing channel cracks. The driving force for... View More

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