IEEE - Institute of Electrical and Electronics Engineers, Inc. - Singularities at solder joint interfaces and their effects on fracture models: Part II

2008 11th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITHERM '08)

Author(s): D. Bhate ; G. Subbarayan ; L. Nguyen ; J. Zhao
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 May 2008
Conference Location: Orlando, FL, USA
Conference Date: 28 May 2008
Page(s): 746 - 750
ISBN (CD): 978-1-4244-1701-8
ISBN (Paper): 978-1-4244-1700-1
ISSN (Paper): 1087-9870
DOI: 10.1109/ITHERM.2008.4544342
Regular:

The problem of solder joint fatigue is essentially one of fatigue crack growth. However, little work has been done that enables fatigue life predictions by means of tracking the crack front and... View More

Advertisement