IEEE - Institute of Electrical and Electronics Engineers, Inc. - Ultra low-k dielectric mechanical property characterization

2008 11th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITHERM '08)

Author(s): V. Gupta ; Jie-Hua Zhao ; D. Edwards ; C.D. Mortensen ; C. Heideman ; D.C. Johnson ; K.-H.G. Lu ; P.S. Ho
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 May 2008
Conference Location: Orlando, FL, USA
Conference Date: 28 May 2008
Page(s): 714 - 719
ISBN (CD): 978-1-4244-1701-8
ISBN (Paper): 978-1-4244-1700-1
ISSN (Paper): 1087-9870
DOI: 10.1109/ITHERM.2008.4544338
Regular:

To meet electrical performance requirements, the industry is implementing ultra-low dielectric constant (ULK) materials in the back end of line interconnect structure. ULK dielectrics are... View More

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