IEEE - Institute of Electrical and Electronics Engineers, Inc. - Thermal test- and field cycling induced degradation and its FE-based prediction for different SAC solders

2008 11th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITHERM '08)

Author(s): R. Dudek ; W. Faust ; R. Ratchev ; M. Roellig ; H.-J. Albrecht ; B. Michel
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 May 2008
Conference Location: Orlando, FL, USA
Conference Date: 28 May 2008
Page(s): 668 - 675
ISBN (CD): 978-1-4244-1701-8
ISBN (Paper): 978-1-4244-1700-1
ISSN (Paper): 1087-9870
DOI: 10.1109/ITHERM.2008.4544332
Regular:

A study of the performance of different Sn based solder alloys applied for large to small sized solder interconnects was undertaken. From the theoretical and experimental investigations on creep,... View More

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