IEEE - Institute of Electrical and Electronics Engineers, Inc. - Fluid-to-fluid spot-to-spreader (F2/S2) hybrid heat sink for integrated chip-level and hotspot-level thermal management

2008 11th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITHERM '08)

Author(s): C. Green ; A.G. Fedorov ; Y.K. Joshi
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 May 2008
Conference Location: Orlando, FL, USA
Conference Date: 28 May 2008
Page(s): 510 - 519
ISBN (CD): 978-1-4244-1701-8
ISBN (Paper): 978-1-4244-1700-1
ISSN (Paper): 1087-9870
DOI: 10.1109/ITHERM.2008.4544311
Regular:

An innovative heat sink design aimed at meeting both the hotspot and large background heat flux requirements of next generation integrated circuits is presented. The heat sink design utilizes two... View More

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