IEEE - Institute of Electrical and Electronics Engineers, Inc. - Design of thermal interfaces with embedded microchannels to control bond line formation

2008 11th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITHERM '08)

Author(s): B. Smith ; H. Rothuizen ; R. Linderman ; T. Brunschwiler ; B. Michel
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 May 2008
Conference Location: Orlando, FL, USA
Conference Date: 28 May 2008
Page(s): 410 - 418
ISBN (CD): 978-1-4244-1701-8
ISBN (Paper): 978-1-4244-1700-1
ISSN (Paper): 1087-9870
DOI: 10.1109/ITHERM.2008.4544299
Regular:

Integrating microchannels at the thermal interfaces of heat sinks, spreaders, and microprocessor chips can reduce bond line thickness, assembly pressure, and overall thermal resistance. The... View More

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