IEEE - Institute of Electrical and Electronics Engineers, Inc. - Comparison of thermal performances of plate-fin and pin-fin heat sinks subject to an impinging flow

2008 11th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITHERM '08)

Author(s): Dong-Kwon Kim ; Jin-Kwon Bae ; Sung Jin Kim
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 May 2008
Conference Location: Orlando, FL, USA
Conference Date: 28 May 2008
Page(s): 360 - 366
ISBN (CD): 978-1-4244-1701-8
ISBN (Paper): 978-1-4244-1700-1
ISSN (Paper): 1087-9870
DOI: 10.1109/ITHERM.2008.4544292
Regular:

In this paper, we compare thermal performances of two-types of heat sinks commonly used in the electronic equipment industry: plate-fin and pin-fin heat sinks. In particular, heat sinks subject to... View More

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