IEEE - Institute of Electrical and Electronics Engineers, Inc. - Evaporation-enhanced, dynamically-adaptive air (gas)-cooled heat sink for thermal management of high heat dissipation devices

2008 11th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITHERM '08)

Author(s): A.G. Fedorov ; J.M. Meacham
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 May 2008
Conference Location: Orlando, FL, USA
Conference Date: 28 May 2008
Page(s): 333 - 340
ISBN (CD): 978-1-4244-1701-8
ISBN (Paper): 978-1-4244-1700-1
ISSN (Paper): 1087-9870
DOI: 10.1109/ITHERM.2008.4544288
Regular:

To address the thermal management challenges associated with high power dissipation devices, we describe a novel hybrid thermal management device, which enables significant enhancement of... View More

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