IEEE - Institute of Electrical and Electronics Engineers, Inc. - System level thermal performance optimization of leaded packages for automotive applications

2008 11th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITHERM '08)

Author(s): V.A. Chiriac
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 May 2008
Conference Location: Orlando, FL, USA
Conference Date: 28 May 2008
Page(s): 296 - 301
ISBN (CD): 978-1-4244-1701-8
ISBN (Paper): 978-1-4244-1700-1
ISSN (Paper): 1087-9870
DOI: 10.1109/ITHERM.2008.4544283
Regular:

The conjugate steady-state and transient thermal performance of leaded package (30 Id HSOP) for automotive application in a custom environment is evaluated and further optimized using numerical... View More

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