IEEE - Institute of Electrical and Electronics Engineers, Inc. - SLACP: A Novel Link-Layer Protocol for Wireless WANs

2008 Seventh International Conference on Networking (ICN '08)

Author(s): D. Astuti ; A. Nyrhinen ; I. Jarvinen ; M. Kojo
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 April 2008
Conference Location: Cancun, Mexico
Conference Date: 13 April 2008
Page(s): 121 - 130
ISBN (CD): 978-0-7695-3106-9
DOI: 10.1109/ICN.2008.113
Regular:

In this paper, we discuss the design details of a TCP/IP- friendly link-layer protocol with novel design to improve TCP performance on network paths involving a Wireless Wide-Area Network (WWAN)... View More

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