IEEE - Institute of Electrical and Electronics Engineers, Inc. - Efficient Super-Smooth Finishing Characteristics of SiC Materials through the Use of Fine-Grinding

International Conference on Smart Manufacturing Application

Author(s): H. Kasuga ; H. Ohmori ; Weimin Lin ; Y. Watanabe ; T. Mishima ; T. Doi
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 April 2008
Conference Location: Gyeonggi-do, South Korea
Conference Date: 9 April 2008
Page(s): 5 - 8
ISBN (CD): 978-89-962150-0-4
ISBN (Paper): 978-89-950038-8-6
DOI: 10.1109/ICSMA.2008.4505602
Regular:

Silicon carbide (SiC) materials have increasingly been needed in the wide range of industries, such as for structural components, automobile parts, space telescope, X-ray mirror, and... View More

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