IEEE - Institute of Electrical and Electronics Engineers, Inc. - UV-assisted Thermal Imprint of SU-8 Using Nickel Mold

International Conference on Smart Manufacturing Application

Author(s): Sung-Won Youn ; A. Ueno ; M. Takahashi ; R. Maeda
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 April 2008
Conference Location: Gyeonggi-do, South Korea
Conference Date: 9 April 2008
Page(s): 389 - 392
ISBN (CD): 978-89-962150-0-4
ISBN (Paper): 978-89-950038-8-6
DOI: 10.1109/ICSMA.2008.4505559
Regular:

As an epoxy-based negative photoresist, SU-8 is being widely used for various permanent use MEMS devices due to its excellent thermal and chemical stability. Due to its UV curability, classical... View More

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