IEEE - Institute of Electrical and Electronics Engineers, Inc. - Investigating the Impact of Fill Metal on Crosstalk-Induced Delay and Noise

2008 9th International Symposium on Quality Electronic Design (ISQED '08)

Author(s): A. Nieuwoudt ; J. Kawa ; Y. Massoud
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 March 2008
Conference Location: San Jose, CA, USA
Conference Date: 17 March 2008
Page(s): 724 - 729
ISBN (Paper): 978-0-7695-3117-5
DOI: 10.1109/ISQED.2008.4479827
Regular:

In this paper, we investigate the crosstalk-induced delay and noise implications of floating and grounded fill metal generated using each of the rule-based and model-based fill placement... View More

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