IEEE - Institute of Electrical and Electronics Engineers, Inc. - Techniques for Early Package Closure in System-in-Packages

2008 9th International Symposium on Quality Electronic Design (ISQED '08)

Author(s): S.C. Vaidyanathan ; A.M. Brahme ; S. Jairam
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 March 2008
Conference Location: San Jose, CA, USA
Conference Date: 17 March 2008
Page(s): 608 - 613
ISBN (Paper): 978-0-7695-3117-5
DOI: 10.1109/ISQED.2008.4479807
Regular:

The two main forces pushing package technologies to a new frontier are size and cost. The need of the hour is miniaturization, fuelled by rapidly growing complexity in the wireless phone market.... View More

Advertisement