IEEE - Institute of Electrical and Electronics Engineers, Inc. - System-in-Package Technology: Opportunities and Challenges

2008 9th International Symposium on Quality Electronic Design (ISQED '08)

Author(s): A. Fontanelli
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 March 2008
Conference Location: San Jose, CA, USA
Conference Date: 17 March 2008
Page(s): 589 - 593
ISBN (Paper): 978-0-7695-3117-5
DOI: 10.1109/ISQED.2008.4479803
Regular:

In 2006, the leading wireless phone industry has introduced literally hundreds of new, different wireless phones, which have been manufactured in approximately 1 billion units, generating revenue... View More

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