IEEE - Institute of Electrical and Electronics Engineers, Inc. - Thermal Aware Global Routing of VLSI Chips for Enhanced Reliability

2008 9th International Symposium on Quality Electronic Design (ISQED '08)

Author(s): A. Gupta ; N.D. Dutt ; F.J. Kurdahi ; K.S. Khouri ; M.S. Abadir
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 March 2008
Conference Location: San Jose, CA, USA
Conference Date: 17 March 2008
Page(s): 470 - 475
ISBN (Paper): 978-0-7695-3117-5
DOI: 10.1109/ISQED.2008.4479779
Regular:

In this paper we propose thermal aware global routing of interconnects which reduces the probability of failure of chips due to interconnect failures. Temperature has a very serious effect on the... View More

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