IEEE - Institute of Electrical and Electronics Engineers, Inc. - TiN coating/glass substrate system fabricated for hot-embossing stamp at multi-scale

3rd IEEE International Conference on Nano/Micro Engineered and Molecular Systems

Author(s): H.R. Wang ; Z.T. Zhou ; Z.D. Jiang ; G.L. Sun ; X.N. Gao ; Chuan Yang
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 January 2008
Conference Location: Sanya, China
Conference Date: 6 January 2008
Page(s): 1,104 - 1,107
ISBN (CD): 978-1-4244-1908-1
ISBN (Paper): 978-1-4244-1907-4
DOI: 10.1109/NEMS.2008.4484511
Regular:

For the hot-embossing lithography, imprinting stamp with long-life span, good anti-wear property and precise geometrical shape, is much expected for pushing forward the technology to industrial... View More

Advertisement