IEEE - Institute of Electrical and Electronics Engineers, Inc. - Development of transdermal delivery chip system: Deliver gold nanoparticles into human stratum corneume

3rd IEEE International Conference on Nano/Micro Engineered and Molecular Systems

Author(s): Hung-Yi Chen ; Qiaole Zhao ; Kuei-Ling Su ; Yu-Cheng Lin
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 January 2008
Conference Location: Sanya, China
Conference Date: 6 January 2008
Page(s): 996 - 999
ISBN (CD): 978-1-4244-1908-1
ISBN (Paper): 978-1-4244-1907-4
DOI: 10.1109/NEMS.2008.4484489
Regular:

This paper reports a transdermal delivery chip system for delivering gold nanoparticles (AuNPs) into human stratum corneum (HSC). The proposed transdermal delivery chip system could provide... View More

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