IEEE - Institute of Electrical and Electronics Engineers, Inc. - On the design and fabrication of metal molds in LIGA

3rd IEEE International Conference on Nano/Micro Engineered and Molecular Systems

Author(s): Yuhua Guo ; Yangchao Tian ; R. Du
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 January 2008
Conference Location: Sanya, China
Conference Date: 6 January 2008
Page(s): 990 - 995
ISBN (CD): 978-1-4244-1908-1
ISBN (Paper): 978-1-4244-1907-4
DOI: 10.1109/NEMS.2008.4484488
Regular:

Most previous research on electroplating in LIGA has been focused on electrodeposition of metal into high aspect ratio resist cavities. The process in which the metal grows up crossing the top of... View More

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