IEEE - Institute of Electrical and Electronics Engineers, Inc. - High-frequency surface acoustic wave (SAW) devices fabricated by contact-transferred and mask-embedded lithography

3rd IEEE International Conference on Nano/Micro Engineered and Molecular Systems

Author(s): Chin-Hsin Liu ; Cheng-Yu Chiu ; Yung-Chun Lee ; Shuo Hung Chang
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 January 2008
Conference Location: Sanya, China
Conference Date: 6 January 2008
Page(s): 402 - 405
ISBN (CD): 978-1-4244-1908-1
ISBN (Paper): 978-1-4244-1907-4
DOI: 10.1109/NEMS.2008.4484359
Regular:

This paper reports the application of a newly developed lithography method, the contact transfer and mask-embedded lithography (CMEL), in fabricating high-frequency (~2 GHz) surface acoustic wave... View More

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