IEEE - Institute of Electrical and Electronics Engineers, Inc. - A new method for the micro-tensile testing of thin film

3rd IEEE International Conference on Nano/Micro Engineered and Molecular Systems

Author(s): Rui Liu ; Xueping Li ; Hong Wang ; Guifu Ding ; Chunsheng Yang ; Zhuoqing Yang
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 January 2008
Conference Location: Sanya, China
Conference Date: 6 January 2008
Page(s): 112 - 115
ISBN (CD): 978-1-4244-1908-1
ISBN (Paper): 978-1-4244-1907-4
DOI: 10.1109/NEMS.2008.4484298
Regular:

A new method for testing the mechanical characterization of freestanding thin films is designed. The new micro-tensile structure is suitable for testing thin films with large strain. The uniaxial... View More

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