IEEE - Institute of Electrical and Electronics Engineers, Inc. - Electronics Cooling Using a Self-Contained, Sub-Cooled Pumped Liquid System

SEMI-THERM '08. 2008 24th Annual IEEE Semiconductor Thermal Measurement and Management Symposium

Author(s): W.J. Bilski ; G. Baldassarre ; M. Connors ; J. Toth ; K.L. Wert
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 March 2008
Conference Location: San Jose, CA, USA
Conference Date: 16 March 2008
Page(s): 137 - 141
ISBN (CD): 978-1-4244-2124-4
ISBN (Paper): 978-1-4244-2123-7
ISSN (Paper): 1065-2221
DOI: 10.1109/STHERM.2008.4509380
Regular:

Electronic thermal packaging design continues to look for novel solutions for enhancing the performance of microelectronic cooling solutions. Driven by increasing thermal performance requirements,... View More

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