IEEE - Institute of Electrical and Electronics Engineers, Inc. - Thermal Characteristics of Integrated Module Board

SEMI-THERM '08. 2008 24th Annual IEEE Semiconductor Thermal Measurement and Management Symposium

Author(s): T. Karila ; P. Palm
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 March 2008
Conference Location: San Jose, CA, USA
Conference Date: 16 March 2008
Page(s): 83 - 89
ISBN (CD): 978-1-4244-2124-4
ISBN (Paper): 978-1-4244-2123-7
ISSN (Paper): 1065-2221
DOI: 10.1109/STHERM.2008.4509371
Regular:

In traditional approach of electronics manufacturing, active and passive components are mounted on printed circuit board (PCB) utilizing surface mount technology (SMT). Due to the continuous... View More

Advertisement