IEEE - Institute of Electrical and Electronics Engineers, Inc. - Modeling and Validation of On-Die Cooling of Dual-Core CPU using Embedded Thermoelectric Devices

SEMI-THERM '08. 2008 24th Annual IEEE Semiconductor Thermal Measurement and Management Symposium

Author(s): R. Alley ; M. Soto ; L. Kwark ; P. Crocco ; D. Koester
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 March 2008
Conference Location: San Jose, CA, USA
Conference Date: 16 March 2008
Page(s): 77 - 82
ISBN (CD): 978-1-4244-2124-4
ISBN (Paper): 978-1-4244-2123-7
ISSN (Paper): 1065-2221
DOI: 10.1109/STHERM.2008.4509370
Regular:

Today's high density processor circuits produce areas of high heat flux which can impose a thermal ceiling on product performance. Chip scale cooling solutions unnecessarily add to the heat sink... View More

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