IEEE - Institute of Electrical and Electronics Engineers, Inc. - An Alternate Method of Fabricating Multilayer-Multichip Ceramic Substrates

Author(s): W. Dougherty ; S. Greer
Sponsor(s): IEEE
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 June 1983
Volume: 6
Page(s): 150 - 153
ISSN (Paper): 0148-6411
DOI: 10.1109/TCHMT.1983.1136169
Regular:

In the IBM Corporation, packaging designs have evolved from single-sided circuitry on pinned ceramics to complex, multilayer structures with internally interconnected wiring produced with "punch... View More

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